LumiereOpto-Photonicsintroduces COB (Chip-on-Board) Ceramic LED Assemblies and Arrays for High Temperature and High Reliability Applications

 Lumiereis a supplier of materials,opto-photonics components and assembly servicesofferings withthe introduction of custom "chip-on-ceramic" LEDs and LED arrays.This latest line of custom assembliesleverages Luminere’s recognized expertise in component and material development to offer manufacturers and integrators reliable, high-efficiency ceramic LED components across a full range of color temperatures.

The chip-on-ceramic LEDs are available in configurations from tenths to hundreds of chips in series or parallel, as well as series/parallel combinations. Luminere has also expanded its full service integration and production capabilities, and is capable of volume production with a range of chip-on-ceramic and integrated light engines/modules to support the needs of the general lighting, medical and military industries.

With years of experience in the optoelectronics industry, Luminere has the capability to produce custom chip-on-ceramic devices in a wide variety of package styles and wavelengths to create the ideal module or array for your specific application. Luminere’s applications and technical engineering staff can assist you in choosing the best combination of die and package type to build devices that are matched to your application specifications. From prototyping and design to custom assemblies and testing, we have the expertise necessary to bring a concept through to production.

 QUALITY

• We provide best quality and service to our customersfrom the beginning
• We strive for continuous improvement and showzero tolerance to defects

 FOCUS

• We set priorities and are consistent in achieving ourtargets
• Our focus is driven by our customers’ expectations

Ceramic PCB COB LED Light Engine 

COB Light Engine

Description	Ceramic PCB COB Light Engine	Aluminum PCB COB Light Engine	Others Light Engine
Product photo
Luminescencemethod	Surface	Surface	Point
Glare	Insignificant	Insignificant	Significant
Thermal Shock Test	Both of the PCB and dies substrate is ceramic, which similar in the thermal expansionCoefficient. No temperature shock will cause the dies failure and luminous decay and dead light	Thermal expansionCoefficient of the Aluminum PCB is 4 times higher than the dies ceramic substrate; the temperature shock will cause the reliability problems	Same as Aluminum PCB COB Light Engine
85℃ high temperature and 85% humidity Test	Use of high quality packaging materials and result of high weatherability	The market value of the light engine is lower than US$0.85/W might have a sever luminous decay in a short time	The market value of the light engine is lower than US$0.60/W might have a sever luminous decay in a short time
Thermal Resistance	Very low	Low	High
Thermalconductivity	high thermal conductivity with large conductivity area for effective heat dissipation, ease of thermal management and low cost	Thermal conductivity is lower than the ceramic; large conductivity area for heat dissipation, ease of thermal cooling and low cost	Thermal conductivity is low, thermal area is small and the heat is concentrated. More difficult thermal design, cooling costs are high
High voltage resistance	>4000V	<600V	6<00V
Finishedlampsproduct design with non-isolated power forUL / GScertification	Qualify	Difficult	Difficult
Finishedlampsproduct design with isolated power forUL / GScertification	Qualify	Qualify, but Loss oflight efficiency	Qualify, but Loss oflight efficiency
Power Matching	Withhighvoltagesafety, any ceramicCOB5W and aboveare designed toVf> 24V,low currenthigh voltageto match thenon-isolated power supply to reducepowercosts, improvepower efficiency, enhance power supplyreliability	In order to qualify the UL / GScertification, isolated power must be use; in result loss of power efficiencyand reliability.particularlyevident in highwattagefinished lampsproduct	Same as Aluminum PCB COB Light Engine
light efficiency	100-120lm/w	50-75 lm/w	80-100lm/w
Luminescence pattern
Lighting effect
Lm/RMB	17-20lm/RMB	10-14lm/RMB	15-18lm/RMB
Cooling cost	Resistance is small, thermal path short with large thermal dissipation area; the cost of cooling can effectively reduce.	Thermal path short with large thermal dissipation area, but resistance is larger than ceramic. Higher cooling cost than ceramic.	Large thermal resistance and long thermal path, small thermal dissipation area, highcooling costs
Installintegration costs	Directmountingon theheat sink and low cost.	Directmountingon theheat sink and low cost.	First solder on FR4 PCB or MCPCB and then fixed on the heat sink, the high cost is high
Cost of power supply matching	ForUL / GScertification, non-isolated power supply can be used. Low cost.	Non-isolated power supply must be used to qualify for the UL / GScertification. High cost.	Non-isolated power supply must be used to qualify for the UL / GScertification. High cost.