With this technology, the LED chips are in the form of a semiconductor chip (die) size between 100~200 micron. The individual chips are placed on the ceramic substrate PCB and using the Wire Bonding method, connected to the contact surface of the ceramic substrate PCB. Gold wires in the micrometer range are used for contacting the semiconductor chip and the substrate. The COB technology allows for virtually limitless freedom of scope for the PCBs and thus serves as the basis for totally unique LED solutions. Furthermore Lumiere is using ceramic as substrate of which will improve the internal quantum efficiency and increase heat dissipation. The careful design of the ceramic PCB and selection of quality dies in consequences minimize electrical losses and light extraction on the dies and improve the LED efficiency.